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Investigation of Printing EEE Components using Additive Manufacturing Methods

26 April 2024

Duration: 18 months


This project develops novel technologies integrating additive manufacturing (AM) with contact printing methods for EEE components for space applications. The novelty lies in

  1. using a 3D printing for the first time to print a range of EEE components (inductors, capacitors and resistors)
  2. investigating a hybrid AM approach for EEE features for Space applications, by enhancing an existing printer (limited to two materials) using other materials by means of other printing methods, and
  3. assessing the Space compatibility of 3D printed EEE functions.

By adopting this approach performance benefits include the design of novel configurations, weight saving, miniaturization, and the flexible use of substrates. The development of these novel technologies will disrupt traditional supply chain routes, shorten lead times, decrease costs, and improve European EEE manufacturing.

This project aims to develop a novel approach and produce test coupons of a variety of EEE functions using the Dragonfly Printer with other contact printing techniques. In particular: 

  • A test coupon will be designed to capture the key functionality requirements to maximise the capability of the existing printing technologies
  • Coupons will be manufactured in-house by MTC using the Dragonfly LDM inkjet printer.
  • Coupons will be tested by MTC and ESA to characterise the material and electrical properties and degradation from the Space environment (thermal cycling, outgassing).

The MTC hosts the only Nano Dimension Dragonfly LDM Inkjet printer commercially available in the UK to manufacture novel EEE structures.

Contract number
OSIP Idea Id
Related OSIP Campaign
Open Channel
Main application area
Generic for multiple space applications
Investigation of Printing EEE Components using Additive Manufacturing Methods