Skip to main content

High temperature lead free solder for internal soldering of EEE parts

Running

Running

Organisational Unit
Implementation progress
0%
01 March 2022

Duration: 18 months

Objective

Lead free solder finish is widely available in industry and use in almost all COTS EEE parts. However, high temperature solder material is needed, for internal soldering, to manufacture different types of EEE parts like stacked ceramic capacitor, transformer or relay.

This solder material is usually made with lead. Several manufacturers are looking for alternative to be compliant with lead free requirement. The activity should aim to find at least one solder material without lead or a process to replace the high soldering temperature today used by most of the manufacturer. This material or process should be compliant with the requirement (ie temperature, long operating type application) for mounting EEE part on PCB using the current soldering temperature in space application but also the lead free process used in commercial application.

Contract number
4000137479
Programme
OSIP Idea Id
I-2020-04178
Related OSIP Campaign
COTS Campaign
Main application area
Generic for multiple space applications
Budget
175000€
High temperature lead free solder for internal soldering of EEE parts