In the selection process of active COTS plastic encapsulated components (PEC) for space programs, interfacial delamination found during C-mode scanning acoustic microscopy (C-SAM) analyses is in our experience the single most frequent finding that leads to lengthy discussions or rejections of components vital to specific equipment designs. Strikingly, however, we also experience that such interfacial delamination is quite a common finding in even higher-grade components for military or automotive applications by notable manufacturers. Furthermore, we find that the information and quantitative data publicly available to the space community on the basis of which use decisions can be taken, is virtually non-existent. With this study we intend to provide to the space community with qualitative and quantitative reliability data with respect to thermal stress for future use decisions in case of delamination findings during C-SAM. Furthermore, the findings of this study might trigger an update of the ESCC basic specification 25200 “Application of Scanning Acoustic Microcopy To Plastic Encapsulated Devices”. We believe that our study is valuable for literally everybody planning to use COTS PEC in his or her space application.
