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Reliability analysis of plastic encapsulated active components exhibiting interfacial delamination in CSAM

Running

Running

Organisational Unit
Activity Type
Implementation progress
32%
10 November 2021

Duration: 12 months

Objective

In the selection process of active COTS plastic encapsulated components (PEC) for space programs, interfacial delamination found during C-mode scanning acoustic microscopy (C-SAM) analyses is in our experience the single most frequent finding that leads to lengthy discussions or rejections of components vital to specific equipment designs.  Strikingly, however, we also experience that such interfacial delamination is quite a common finding in even higher-grade components for military or automotive applications by notable manufacturers.  Furthermore, we find that the information and quantitative data publicly available to the space community on the basis of which use decisions can be taken, is virtually non-existent. With this study we intend to provide to the space community with qualitative and quantitative reliability data with respect to thermal stress for future use decisions in case of delamination findings during C-SAM. Furthermore, the findings of this study might trigger an update of the ESCC basic specification 25200 “Application of Scanning Acoustic Microcopy To Plastic Encapsulated Devices”. We believe that our study is valuable for literally everybody planning to use COTS PEC in his or her space application.

Contract number
4000136430
OSIP Idea Id
I-2020-04182
Related OSIP Campaign
COTS Campaign
Subcontractors
Tesat-Spacecom Gmbh & Co.Kg
Main application area
Generic for multiple space applications
Budget
92900€
Topical cluster
Reliability analysis of plastic encapsulated active components exhibiting interfacial delamination in CSAM - New ideas for the use of Commercial Off The Shelf (COTS) components -Study