Whereas plastic package is proposed as the right solution to reduce mass / cost and lead time. There are specific application which demand wide operating tremperature ranges, either to cover the demanded derating rules or when used in a more stringent applications. Efforts need to be done to get knowledge / develop temperature characterization to evaluate at new temperature ranges, including very high / very low temp, exceeding also the classic -55 / +125ºC ranges. Our initial idea is to focus on high power / high voltage parts for which we have already received some demands from large integrators so to define specific alternatives in plastic package on some critical technologies (i.e. protection diodes). The proposed work is to understand the boundaries on plastic package at very low / very high temperature covering all associated process. Hence, we are also open to discuss other parts (i.e. mems, passive, etc., as needed) Activities will be specifically focused on temperature and power stress step following same approach that previous contract with ESA on passive parts. Ref. 4000109461/13/NL/PA “European Component Initiative, Capacitors and Resistors with extended operating temperature for GaN applications but: · Our approach is to focus on plastic active parts as potential lower cost replacement on ceramic / metallic alternatives · Analysis to be extended also to cover low temperature requirements with particular focus on thermal stress.
